Thermal Shock Testing
Thermal Shock Testing
What is this?
Thermal shock is a process where the product is exposed to extremes of high and low temperatures with very short transition periods between the temperature levels. The stress induced will expose temperature related weaknesses in the product.
Why is this performed?
This type of testing is very useful in determining thermal fatigue limits, forcing latent defects into failures, and detecting other design flaws such as poor solder joints and deficient components. Through rigorous qualification testing by exposure to temperature shocks potential design defects will be eliminated from the products.
