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Thermal Shock Testing

Temperature changes create contraction and expansion in various materials. These movements induced by their linear coefficients of thermal expansion will induce stress.

Thermal Shock Testing is a process where the product is exposed to extremes of High and Low temperatures with very short transition times (seconds) between both temperature levels.

It is very useful in forcing latent defects into failures detecting poor solder joints and weaknesses such as cracks in components.Through rigorous qualification testing by exposure to temperature shocks potential design defects will be eliminated from products during the design cycle.

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Case Study – Emerson Network Power

Case Study

Emerson Network Power logo

How Anecto developed a number of innovative solutions for the leading multinational Emerson Network Power.